YES Panel-Level Through Glass Via (TGV) Etch Tool Placed in Production
FREMONT, Calif., July 2, 2024 /PRNewswire/ -- YES, a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and AR/VR applications, today announced that Its TersOnus TGV tool was released for panel-level manufacturing. This system will be used to support the growth of advanced heterogeneous packaging for artificial intelligence chips that enable large language models. The TersOnus TGV system provides superior quality and total cost of ownership for manufactu...